Apple set to release the iPhone 8, iPhone 7s plus and iPhone 7s in 2017.

All you need to know about the iPhone 8 and iPhone 7s.

Later in 2017 iPhone 8 and iPhone 7s will share the exact powerful next-gen processor.




Following the launch of Samsung S8 smartphone, Apple are expected to release three different iPhone models later in 2017. This will include the iPhone 8, iPhone 7s, and iPhone 7s Plus.

The Apple iPhone 8 would be the top end and the premium smartphone. It is expected to offer a variety of features that won’t be available on the iPhone 7s models. However, all three iPhones will reportedly share the same powerful new A11 chip.

Following the rumours and reports indicated that chipmakers were experiencing low yields with 10nm CPUs that will power the Galaxy S8 and iPhone 8, a new report from Asia specifically China indicates that TSMC is ready to start A11 production in April.

The Chinese news site media Economic Daily News, Digitimes says, “the A11 volume production will start in April and the company is preparing to mass-produce 50 million units before July and maintain capacity to manufacture 100 million A11 chips before the end of the year”.

Base on the details from Economic Daily News, it indicates that Apple will use the faster, more energy-efficient A11 chip in all the iPhone 8, iPhone 7s, and iPhone 7s Plus later this year.

It show have wireless charging and the fast charging technology with mobile phone charging stations.



Every year Apple normally upgrades the processors in its new iPhones as History shows with their past devices. The only expectation is the iPhone 5c that launched alongside the iPhone 5s in 2013 packed the same A6 chip found inside the previous-generation iPhone 5.

The initial benchmark results for the Qualcomm Snapdragon 835 and Exynos 8895, the 10nm chips that power the Galaxy S8, are already out, revealing massive performance gains for the upcoming Samsung handset. It’s likely the A11 chip will offer a similar, if not better, performance.

Additional information on the report shows that the A11 chips are built on a 10nm FinFET process, packing wafer-level integrated fan-out (InFO) packaging technology. Also the bottom line is that it will result is a smaller chip ready to offer better performance while utilizing less energy. Yes this sounds complicated and expensive.



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